Nebraska Patent of the Month – October 2023

Machine-to-machine (M2M) communications have been used to facilitate the remote monitoring of devices across nearly every industry. However, they have often come with hefty development costs and significant time-to-market delays. Furthermore, customization and integration with the latest technology standards have been challenging, leaving room for improvement.

Signetik, LLC, who has built a reputation developing electronic/embedded engineering designs, has recently been granted a patent for their systems-in-package cellular assembly which strives to make M2M communication more accessible. 

Signetik’s innovation features a multi-layer printed circuit board with through holes designed to receive end-product connecting members. This assembly is configured to provide seamless connectivity for end-products, making it a game-changer for various applications.

The main board assembly is a key component, boasting a system-in-package device that includes a modem, a microcontroller unit with powerful processors, and a network server with an application programming interface. These processors are primed to communicate with end-products, offering essential processing capabilities.

To maintain diversity in applications, the design incorporates features like cellular antenna ports, location antenna ports, and even subscriber identification module (SIM) card slots. They’ve also added embedded SIM cards, power regulation devices, and light-emitting diodes, ensuring that their system-in-package cellular assembly is well-equipped for a variety of applications and industries.

Complementing this main board assembly is the add-on board assembly, which introduces sensor capabilities and battery connectors. These add-ons can enhance the functionality of the end-product, providing valuable sensor data that can be communicated to the network server. The clever coupling design ensures a secure and reversible connection to the main board.

Signetik’s cutting-edge system-in-package cellular assembly promises to reshape M2M communications. It not only streamlines the development process but also offers a high degree of customization and compatibility with the latest technological standards. This innovation has the potential to be a game-changer across a multitude of industries, making it an exciting development in the ever-evolving world of technology and communications.

Are you developing new technology for an existing application? Did you know your development work could be eligible for the R&D Tax Credit and you can receive up to 14% back on your expenses? Even if your development isn’t successful your work may still qualify for R&D credits (i.e. you don’t need to have a patent to qualify). To find out more, please contact a Swanson Reed R&D Specialist today or check out our free online eligibility test.

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