Hawaii Patent of the Month – July 2025
Researchers have developed a compact optical system for real-time 3D hyperspectral imaging. The invention, from HI-Spectral LLC , integrates key components. This allows for simultaneous capture of spatial and spectral data. The technology promises to shrink hyperspectral cameras, enabling new applications.
Innovative Design Shrinks Camera Size
The system, called a machined image slicer compact spectrograph (MICS), combines two main parts. A two-mirror integral field unit first divides the incoming light. It uses an array of tiny mirrors. This unit then reformats the light into a series of slices. A micro spectrograph array then processes these slices. It uses powered optics and diffraction gratings. This design eliminates the need for large, external spectrographs. The result is a much smaller, more efficient system.
New Opportunities for Hyperspectral Imaging
Hyperspectral imaging is used in many fields. It can identify materials and chemical elements. Current systems are often bulky and complex. This new patent could change that. The compact design opens the door for smaller devices. It could lead to applications in drones, satellites, or medical diagnostics. The technology is detailed in U.S. Patent Application No. 20250216257, titled ‘Optical component and system for simultaneous 3d hyperspectral imaging’. The patent describes how the system scales. This means multiple units can be combined for a wider field of view.
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